DocumentCode
3209956
Title
RDL manufacturing for flip chip packaging
Author
Williams, Brett ; Florence, Deborah ; Dalai, H. ; Gunturu, Krishna ; Nelson, Mark ; Belisle, Chuck
Author_Institution
AMI Semicond., Inc., Pocatello, ID
fYear
2005
fDate
15-15 April 2005
Firstpage
28
Lastpage
31
Abstract
The RDL processing module provides an interconnect redistribution layer (RDL) used in flip chip packaging. The processing of this RDL module is explained in detail along with the design rules used RDL processing is shown to be very robust both structurally and electrically. This technique is compared with the industry to show the unique benefits of the AMIS methodology
Keywords
chip scale packaging; flip-chip devices; integrated circuit interconnections; integrated circuit manufacture; RDL manufacturing; aluminum conductors; flip chip packaging; integrated circuit interconnections; interconnect redistribution layer; Aluminum; Ambient intelligence; Flip chip; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Passivation; Semiconductor device packaging; Sputter etching; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Electron Devices, 2005. WMED '05. 2005 IEEE Workshop on
Conference_Location
Boise, ID
Print_ISBN
0-7803-9072-5
Type
conf
DOI
10.1109/WMED.2005.1431607
Filename
1431607
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