• DocumentCode
    3210117
  • Title

    Computer-aided engineering (CAE) applications in semiconductor device manufacturing and reliability

  • Author

    Groothuis, Steven ; Meade, Roy

  • Author_Institution
    Assembly & Packaging, Micron Technol. Texas, LLC, Allen, TX
  • fYear
    2005
  • fDate
    15-15 April 2005
  • Firstpage
    45
  • Lastpage
    48
  • Abstract
    With the ever increasing complexity of semiconductor device designs, the need for designed-in manufacturability and reliability continues to present a challenge for successful semiconductor product introduction. Technology computer-aided design (TCAD) software tools provide the needed device physics simulations for both functional and performance requirements. However, an innovative approach of using both TCAD tools and computer-aided engineering (CAE) simulation tools (e.g., used in other areas of physics and mechanical engineering) can provide a comprehensive solution to wafer fabrication and device reliability efforts
  • Keywords
    circuit CAD; circuit simulation; design for manufacture; semiconductor device manufacture; semiconductor device reliability; technology CAD (electronics); BEOL; CAE simulation tools; FEOL; TCAD software tools; computer-aided engineering; device physics simulations; semiconductor device manufacturing; semiconductor device reliability; semiconductor product introduction; wafer fabrication; Application software; Computational modeling; Computer aided engineering; Computer aided manufacturing; Computer applications; Physics; Reliability engineering; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices, 2005. WMED '05. 2005 IEEE Workshop on
  • Conference_Location
    Boise, ID
  • Print_ISBN
    0-7803-9072-5
  • Type

    conf

  • DOI
    10.1109/WMED.2005.1431614
  • Filename
    1431614