DocumentCode
3210117
Title
Computer-aided engineering (CAE) applications in semiconductor device manufacturing and reliability
Author
Groothuis, Steven ; Meade, Roy
Author_Institution
Assembly & Packaging, Micron Technol. Texas, LLC, Allen, TX
fYear
2005
fDate
15-15 April 2005
Firstpage
45
Lastpage
48
Abstract
With the ever increasing complexity of semiconductor device designs, the need for designed-in manufacturability and reliability continues to present a challenge for successful semiconductor product introduction. Technology computer-aided design (TCAD) software tools provide the needed device physics simulations for both functional and performance requirements. However, an innovative approach of using both TCAD tools and computer-aided engineering (CAE) simulation tools (e.g., used in other areas of physics and mechanical engineering) can provide a comprehensive solution to wafer fabrication and device reliability efforts
Keywords
circuit CAD; circuit simulation; design for manufacture; semiconductor device manufacture; semiconductor device reliability; technology CAD (electronics); BEOL; CAE simulation tools; FEOL; TCAD software tools; computer-aided engineering; device physics simulations; semiconductor device manufacturing; semiconductor device reliability; semiconductor product introduction; wafer fabrication; Application software; Computational modeling; Computer aided engineering; Computer aided manufacturing; Computer applications; Physics; Reliability engineering; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Electron Devices, 2005. WMED '05. 2005 IEEE Workshop on
Conference_Location
Boise, ID
Print_ISBN
0-7803-9072-5
Type
conf
DOI
10.1109/WMED.2005.1431614
Filename
1431614
Link To Document