DocumentCode
3210452
Title
Sparse Bayesian inference methods for decoding 3D reach and grasp kinematics and joint angles with primary motor cortical ensembles
Author
Zhe Chen ; Takahashi, Koichi
Author_Institution
Harvard Med. Sch., Massachusetts Gen. Hosp., Cambridge, MA, USA
fYear
2013
fDate
3-7 July 2013
Firstpage
5930
Lastpage
5933
Abstract
Sparse Bayesian inference methods are applied to decode three-dimensional (3D) reach to grasp movement based on recordings of primary motor cortical (M1) ensembles from rhesus macaque. For three linear or nonlinear models tested, variational Bayes (VB) inference in combination with automatic relevance determination (ARD) is used for variable selection to avoid overfitting. The sparse Bayesian linear regression model achieved the overall best performance across objects and target locations. We assessed the sensitivity of M1 units in decoding and evaluated the proximal and distal representations of joint angles in population decoding. Our results suggest that the M1 ensembles recorded from the precentral gyrus area carry more proximal than distal information.
Keywords
Bayes methods; biomechanics; physiological models; regression analysis; sparse matrices; variational techniques; 3D reach decoding; M1 unit sensitivity; automatic relevance determination; distal information; distal representation; grasp kinematics; grasp movement; joint angles; nonlinear model; object location; population decoding; precentral gyrus area; primary motor cortical ensemble; proximal information; proximal representation; rhesus macaque; sparse Bayesian inference method; sparse Bayesian linear regression model; target location; three-dimensional reach; variable selection; variational Bayes inference method; Bayes methods; Decoding; Indexes; Joints; Kinematics; Three-dimensional displays; Wrist; Sparse Bayesian inference; neural decoding; primary motor cortex; reach-to-grasp movement;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6610902
Filename
6610902
Link To Document