• DocumentCode
    321047
  • Title

    Implantable electrical conductor flexure fatigue issues

  • Author

    Altman, Pctcr ; Hoffmann, Drew

  • Author_Institution
    Ventritex, Sunnyvale, CA, USA
  • Volume
    1
  • fYear
    1996
  • fDate
    31 Oct-3 Nov 1996
  • Firstpage
    183
  • Abstract
    Recent work calculating bending stresses in implantable conductors has been applied to cine-angiographic measurements of implanted conductor bending radii. The maximum stresses in different conductors due to flexure at the measured radii can be calculated. In evaluating the viability of this approach using the Universal Test Coil (UTC) described in the Draft European Standard for Active Implantable Medical Devices, the maximum equivalent stress at the minimum physiological bending radius was found to be substantially greater than the endurance limit of the MP35N coil material. If this maximum equivalent stress behaves cyclically, this coil conductor should experience failures. However, the UTC has been shown to have acceptable reported survival in chronic studies over three years. This apparent inconsistency shows the difficulty of interpreting static and dynamic strains and their potential contribution to the fatigue failure of implantable conductors
  • Keywords
    bending; biomedical equipment; coils; fatigue; prosthetic power supplies; prosthetics; MP35N coil material; Universal Test Coil; bending radii; bending stresses; cine-angiographic measurements; dynamic strains; endurance limit; flexure fatigue; implantable electrical conductor; maximum equivalent stress; maximum stresses; minimum physiological bending radius; static strains; Cables; Capacitive sensors; Coils; Conducting materials; Conductors; Fatigue; Implantable biomedical devices; Stress measurement; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE
  • Conference_Location
    Amsterdam
  • Print_ISBN
    0-7803-3811-1
  • Type

    conf

  • DOI
    10.1109/IEMBS.1996.656907
  • Filename
    656907