Title :
2004 IEEE International Reliability Physics Symposium. Proceedings (IEEE Cat. No.04CH37533)
Abstract :
The following topics were discussed: novel transistor reliability findings; transistors; back-end integration; gate dielectrics; latchup; products and circuits; memory; interconnects; MEMS; SER/SEU; back-end dielectrics; failure analysis; ESD; RF products and circuits; compound semiconductors; process integration; assembly and packaging.
Keywords :
flip-flops; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; micromechanical devices; semiconductor device packaging; semiconductor device reliability; transistors; ESD; MEMS; RF circuits; RF products; SER/SEU; assembly; back-end dielectrics; back-end integration; compound semiconductors; failure analysis; gate dielectrics; interconnects; latchup; memory; packaging; process integration; products and circuits; transistor reliability;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-8315-X
DOI :
10.1109/RELPHY.2004.1315284
