DocumentCode
3210634
Title
Processing evaluations of an automated high-throughput system for interconnecting crystalline silicon solar cells
Author
Nowlan, M.J. ; Hogan, S.J. ; Patterson, J.S. ; Sutherland, S.F. ; Murach, J.M. ; Breen, W.F. ; Darkazalli, G.
Author_Institution
Spire Corp., Bedford, MA, USA
fYear
1996
fDate
13-17 May 1996
Firstpage
1331
Lastpage
1334
Abstract
The objective of this work is to reduce the cost and improve the quality of terrestrial photovoltaic (PV) modules by developing automated high-throughput (5 MW/yr) processes for interconnecting crystalline silicon solar cells. A new automated processing system was developed for high-throughput, high-yield solar cell interconnection. The results of extensive processing evaluations with a range of different commercially produced cells are reported. Process yields typically exceeded 98%. No degradation in cell performance was observed. Modules made from cell strings fabricated with the new assembly system were subjected to accelerated environmental testing per IEC 1215 and IEEE 1262 standards. Testing consisted of thermal cycling, thermal and humidity-freeze cycling, and damp heat soaking. All modules passed these qualification tests, with an average power loss of only 2.3%
Keywords
elemental semiconductors; environmental testing; freezing; humidity; life testing; semiconductor device testing; silicon; solar cells; standards; thermal analysis; IEC 1215 standard; IEEE 1262 standard; Si; Si solar cells; accelerated environmental testing; automated high-throughput system; average power loss; cell strings fabrication; cost reduction; crystalline silicon solar cells; damp heat soaking; humidity-freeze cycling; qualification tests; quality improvement; solar cells interconnection; terrestrial photovoltaic modules; thermal cycling; Assembly systems; Costs; Crystallization; IEC standards; Photovoltaic cells; Photovoltaic systems; Silicon; Solar power generation; Testing; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
Conference_Location
Washington, DC
ISSN
0160-8371
Print_ISBN
0-7803-3166-4
Type
conf
DOI
10.1109/PVSC.1996.564379
Filename
564379
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