• DocumentCode
    3210647
  • Title

    Direct simulation monte carlo modeling of ionized metal physical vapor deposition for semiconductor processing

  • Author

    Deng, Hao ; Ozawa, Takashi ; Levin, Deborah ; Kushner, Mark J. ; Gochberg, Larry

  • Author_Institution
    Pennsylvania State Univ., University Park, PA, USA
  • fYear
    2009
  • fDate
    1-5 June 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    In this paper, we discuss results from direct simulation Monte Carlo (DSMC) modeling of hollow cathode magnetron (HCMs) for deposition of Cu. DSMC provides the possibility of an exact solution of Boltzmann´s gas dynamic equation, and so should be applicable to lower pressures than conventional computational techniques. To obtain plasma source functions, electric potentials and magnetic fields, the DSMC model has been coupled to the hybrid plasma equipment model (HPEM). The coupling at this stage is achieved by using the quasi-converged flow fields from the HPEM as initial conditions for the DSMC calculations. These conditions include the number density, velocity and temperature as well as the source functions to generate or eliminate particles locally. Assuming quasi-neutrality, electron motion and electron-heavy particle chemical reactions and relaxation are then modeled in the DSMC. Comparison of continuum centric and kinetic centric simulations will be made for HCMs and inductively coupled plasmas, and validated using experimental data.
  • Keywords
    Boltzmann equation; Monte Carlo methods; magnetrons; plasma deposition; plasma flow; Boltzmann gas dynamic equation; HPEM; direct simulation Monte Carlo modeling; electric potential; electron motion; electron-heavy particle chemical reaction; hollow cathode magnetron; hybrid plasma equipment model; inductively coupled plasma; ionized metal physical vapor deposition; magnetic field; number density; plasma source function; quasiconverged flow field; quasineutrality; relaxation; semiconductor processing; source function; temperature; velocity; Cathodes; Chemical vapor deposition; Computational modeling; Magnetic semiconductors; Monte Carlo methods; Plasma density; Plasma simulation; Plasma sources; Plasma temperature; Semiconductor process modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science - Abstracts, 2009. ICOPS 2009. IEEE International Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    0730-9244
  • Print_ISBN
    978-1-4244-2617-1
  • Type

    conf

  • DOI
    10.1109/PLASMA.2009.5227277
  • Filename
    5227277