Title :
Convergence and interaction of BEOL and BE reliability methodology
Author :
Rzepka, Sven ; Lepper, Marco ; Bottcher, M. ; Bauer, Robert ; Weber, Stephan
Author_Institution :
MDC RM, Infincon Technol. SC300 Dresden GmbH & Co KG, Germany
Abstract :
In high volume microelectronic fabrication, increasing convergence and stronger interaction between the features originated in the back end of line (BEOL) and the back end (BE) processes, respectively, can be seen. Without closely combining the BEOL and BE development efforts, the reliability challenges of next generation technologies will not be met in time. The talk discusses the foundation of appropriate reliability strategies.
Keywords :
integrated circuit reliability; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; BE reliability methodology; BEOL reliability methodology; back end of line; back end processes; convergence; high volume microelectronic fabrication; increasing convergence; interaction; stronger interaction; Convergence; Current density; Electrons; Fabrication; Failure analysis; Flip chip; Microelectronics; Packaging; Resistance heating; Silicon;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
DOI :
10.1109/RELPHY.2004.1315301
