• DocumentCode
    3210824
  • Title

    Basic Study of Sterilization at Low Discharge Voltage by Using Microplasma

  • Author

    Shimizu, Kazuo ; Yamada, Masahiro ; Kanamori, Masaki ; Blajan, Marius

  • Author_Institution
    Innovation & Joint Res. Center, Shizuoka Univ., Hamamatsu
  • fYear
    2008
  • fDate
    5-9 Oct. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Sterilization of micro-organism, such as Escherichia coli, is experimentally investigated by using microplasma. Microplasma is suitable for practical application of sterilization, since its discharge voltage is low and its apparatus could be small and inexpensive. In this study, Gram-negative Escherichia coli HB101 and Gram-positive Bacillus subtilis JCB 20036 are used as the target to be sterilized. From the series of experiments, decrease in the amount of germs is effectively obtained after microplasma treatment. The effect of sterilization increases as the discharge voltage increases. When air is used as carrier gas, sterilization rate is 100% at the discharge voltage of 1.05 kV and when nitrogen is the carrier gas, sterilization rate is 77% at the maximum discharge voltage of 1.15 kV for the Escherichia coli. These results could be the combined actions of active radical species such as ozone, UV radiation and, high electrical fields of microplasma. Bacillus subtilis was sterilized with a rate of 97% at a discharge voltage of 1.07 kV in the case of air carrier gas and in the case of gas carrier nitrogen with a rate of 70% at a discharge voltage of 1 kV.
  • Keywords
    biological effects of ultraviolet radiation; cellular biophysics; discharges (electric); microorganisms; nitrogen; oxygen; UV radiation; active radical species; carrier gas; gram-negative Escherichia coli HB101; gram-positive Bacillus subtilis JCB 20036; low discharge voltage; microorganism; microplasma treatment; nitrogen; ozone; sterilization; voltage 1 kV; voltage 1.05 kV; voltage 1.15 kV; Low voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 2008. IAS '08. IEEE
  • Conference_Location
    Edmonton, Alta.
  • ISSN
    0197-2618
  • Print_ISBN
    978-1-4244-2278-4
  • Electronic_ISBN
    0197-2618
  • Type

    conf

  • DOI
    10.1109/08IAS.2008.87
  • Filename
    4658875