DocumentCode :
3211058
Title :
Reliability assessment of ultra-thin HfO2 oxides with TiN gate and polysilicon-n+ gate
Author :
Garros, X. ; Leroux, C. ; Reinibold, G. ; Mitard, J. ; Guillaumot, B. ; Martin, F. ; Autran, J.L.
Author_Institution :
CEA-Leti, Grenoble, France
fYear :
2004
fDate :
25-29 April 2004
Firstpage :
176
Lastpage :
180
Abstract :
In this paper, we propose an extended study of the reliability of ultra-thin HfO2 oxides (EOT<1.5 nm) with polysilicon and TiN gate. Breakdown of the dielectric stacks is shown to be well correlated to trapping in the oxide or to SILC measurements, depending on the stress polarity. Long-term reliability of these high-K dielectrics is also analyzed. At same EOT, HfO2 generally demonstrates higher reliability than SiO2. On high quality stacks, a typical variation of TBD with EOT is also emphasized.
Keywords :
dielectric thin films; electric breakdown; hafnium compounds; integrated circuit reliability; semiconductor device breakdown; silicon; titanium compounds; 1.5 nm; HfO2; SiO2; TiN gate; dielectric stacks breakdown; long-term reliability; polysilicon-n+ gate; reliability assessment; stress polarity; ultra-thin HfO2 oxides; Annealing; Electric breakdown; Electrodes; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Leakage current; Silicon compounds; Stress; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
Type :
conf
DOI :
10.1109/RELPHY.2004.1315320
Filename :
1315320
Link To Document :
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