DocumentCode
321121
Title
External pressure measurements for nerve cuff electrodes
Author
Cuoco, Frank A. ; Durand, Dominique M.
Author_Institution
Appl. Neural Control Lab., Case Western Reserve Univ., Cleveland, OH, USA
Volume
1
fYear
1996
fDate
31 Oct-3 Nov 1996
Firstpage
371
Abstract
When large external pressures are applied to a peripheral nerve, tissue damage can occur via compression and blood flow occlusion, resulting in degeneration and demyelination of axons. This tissue damage must be avoided when implementing nerve cuff electrodes for electrical stimulation of axons. However, post-implant nerve swelling can result in these cuffs exerting large pressures. Currently, only theoretical models are used to predict nerve cuff electrode pressures. The goals of this investigation are (1) to develop a technique to measure external pressures applied by cuff electrodes, (2) to compare experimentally determined cuff pressures with those predicted by theoretical models, and (3) to quantitatively compare different cuff electrodes using a cuff pressure versus nerve diameter relationship. This report describes a pressure measurement technique designed for cuff electrodes and presents some preliminary measurements for various cuff designs
Keywords
bioelectric phenomena; biomechanics; biomedical equipment; biomedical measurement; electrodes; neurophysiology; patient treatment; pressure measurement; axons degeneration; axons demyelination; blood flow occlusion; compression; cuff design; external pressure measurements; functional muscle restoration; nerve cuff electrodes; peripheral nerve; post-implant nerve swelling; pressure measurement technique; theoretical models; tissue damage; Biomedical measurements; Blood flow; Electrodes; Equations; Mercury (metals); Nerve fibers; Predictive models; Pressure measurement; Spirals; Tissue damage;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE
Conference_Location
Amsterdam
Print_ISBN
0-7803-3811-1
Type
conf
DOI
10.1109/IEMBS.1996.656998
Filename
656998
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