Title :
Investigation of reliability problems in thermal inkjet printhead
Author :
Lim, Ji-hyuk ; Keon-Kuk ; Shin, Seung-loo ; Baek, Seog-Soon ; Kim, Young-lae ; Shin, Long-Woo ; Oh, Yong-Soo
Author_Institution :
MEMS Lab., Samsung Adv. Inst. of Technol., Gyeonggi-Do, South Korea
Abstract :
This paper presents a failure analysis result for enhancing the reliability of thermal inkjet printhead. A novel inkjet printhead is fabricated using MEMS process, and we analyze the failure mechanism of inkjet head based on detailed experimental observations. The design modification of micro heater to avoid an early stage of failure yields the reliability enhancement of printhead.
Keywords :
electromigration; failure analysis; ink jet printers; micromechanical devices; semiconductor device reliability; MEMS process; design modification; micro heater; reliability problems; thermal inkjet printhead; Current; Failure analysis; Ink; Micromechanical devices; Nickel; Optical microscopy; Scanning electron microscopy; Shape; Surface cracks; System testing;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
DOI :
10.1109/RELPHY.2004.1315332
