DocumentCode :
3211318
Title :
Dynamic positive bias temperature instability characteristics of ultra-thin HfO2 NMOSFET
Author :
Rhee, Sc Long ; Kim, Young Hee ; Kang, Chang Yong ; Kang, Chang Seok ; Cho, Hag-Ju ; Choi, Rino ; Choi, Chang Hwan ; Akbar, Mohammad S. ; Lee, Jack C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear :
2004
fDate :
25-29 April 2004
Firstpage :
269
Lastpage :
272
Abstract :
We present the threshold voltage instability characteristics of high-k HfO2 NMOSFET dielectric with SiON interface layer under dynamic stress. Compared to DC stress, reduced threshold voltage shift was observed at higher frequency and lower duty cycle in AC unipolar stress. Similarly, the degradation of maximum transconductance was also reduced with AC stress conditions. However, the degradation in subthreshold swing was found to be negligible and fairly independent of stress frequencies and duty cycles in AC unipolar stress. The traps in bulk of HfO2 dielectric, which is proportional to its physical thickness, is believed as the primary factor for larger threshold voltage shift as the thickness of HfO2 increases. Compared to the result under DC constant voltage stress, AC unipolar stress allows higher 10-year lifetime operating voltage.
Keywords :
CMOS integrated circuits; MOSFET; hafnium compounds; integrated circuit reliability; semiconductor device breakdown; semiconductor device reliability; silicon compounds; DC stress; HfO2; SiON; duty cycles; dynamic positive bias temperature instability characteristics; dynamic stress; larger threshold voltage shift; maximum transconductance; reduced threshold voltage shift; stress frequencies; subthreshold swing; ultra-thin HfO2 NMOSFET; Degradation; Frequency; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Stress; Temperature; Threshold voltage; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
Type :
conf
DOI :
10.1109/RELPHY.2004.1315336
Filename :
1315336
Link To Document :
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