DocumentCode :
3211340
Title :
Field emission properties of multi-level self assembled mesoscopic structures on nanoporous templates
Author :
Garre, K. ; Cahay, M. ; Fraser, J.W. ; Lockwood, D.J. ; Kanchibotla, B. ; Bandyopadhyay, S. ; Semet, V. ; Binh, Vu Thien ; Das, B.
Author_Institution :
Univ. of Cincinnati, Cincinnati
fYear :
2007
fDate :
8-12 July 2007
Firstpage :
233
Lastpage :
234
Abstract :
We report a new multi-modal self assembly technique in which a rich structural diversity of distinct moieties emerge when thin films of a wide variety of materials are deposited on nanoporous substrates using different techniques. We also report multi-level self assembly where one set of self assembled nanostructures seeds the self assembly of another set. The multi-modal self assembly has been observed using flexible alumina templates containing hexagonal arrays of cylindrical pores that are 50 nm wide and 500 nm in length and also on nanoporous Si templates. The latter were formed by anodization of thin film alumina templates deposited on platinum coated silicon substrates. The deposition parameters leading to the observation of each of the moieties will be discussed in detail and the field emission (FE) properties, measured by scanning anode field emission microscopy (SAFEM), will be reported.
Keywords :
anodisation; electron field emission; field emission electron microscopy; mesoporous materials; nanoporous materials; platinum; self-assembly; silicon; Al2O3; Pt; Si; anodization; cylindrical pores; field emission properties; flexible alumina templates; hexagonal arrays; multilevel self assembled mesoscopic structures; nanoporous templates; platinum coated silicon substrates; scanning anode field emission microscopy; self assembled nanostructures; size 50 nm; size 500 nm; structural diversity; Iron; Nanoporous materials; Nanostructured materials; Nanostructures; Platinum; Self-assembly; Semiconductor thin films; Silicon; Sputtering; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Nanoelectronics Conference, 2007. IVNC. IEEE 20th International
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4244-1133-7
Electronic_ISBN :
978-1-4244-1134-4
Type :
conf
DOI :
10.1109/IVNC.2007.4481010
Filename :
4481010
Link To Document :
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