DocumentCode :
3211383
Title :
Coupling between two-conductor multi-layer shielded microstrip transmission line
Author :
Elsherbeni, A.Z. ; Moumneh, B. ; Smith, C.E. ; Golestanian, H.
Author_Institution :
Dept. of Electr. Eng., Mississippi Univ., University, MS, USA
fYear :
1993
fDate :
7-9 Mar 1993
Firstpage :
6
Lastpage :
10
Abstract :
The quasi-static TEM mode of a shielded microstrip transmission line is analyzed. The transmission line consists of two perfectly conducting coplanar strips located between two ground planes. Four different dielectric regions are considered: two layers of substrates, a rectangular notch below the strips, and an overlay or a superstrate. The effects of the structure parameters of the shielded transmission line on the odd and even modes´ phase velocities and coupling capacitance are studied. Once the phase velocities are equalized, the design of distortionless lines is achievable. It is found that the presence of the shield allows the reduction of the interline spacing with minimum coupling. With the proper selection of the height of the shield and the separation distance between the strips, it is possible to equalize the phase velocities at more than one combination of the substrate heights
Keywords :
capacitance; coupled mode analysis; electromagnetic shielding; microstrip lines; substrates; coupling capacitance; distortionless lines; interline spacing; overlay; perfectly conducting coplanar strips; phase velocities; quasistatic TEM mode; rectangular notch; shielded microstrip transmission line; substrates; superstrate; Boundary conditions; Capacitance; Coplanar transmission lines; Couplings; Dielectric substrates; Integral equations; Microstrip; Strips; Transmission line theory; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
System Theory, 1993. Proceedings SSST '93., Twenty-Fifth Southeastern Symposium on
Conference_Location :
Tuscaloosa, AL
ISSN :
0094-2898
Print_ISBN :
0-8186-3560-6
Type :
conf
DOI :
10.1109/SSST.1993.522731
Filename :
522731
Link To Document :
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