DocumentCode
3211450
Title
Gold bonding reliability in high density FPGA devices
Author
Lv, Dechun ; Yang, Guangyu
Author_Institution
Inst. of Electron. Eng., China Acad. of Eng. Phys., Mianyang, China
Volume
2
fYear
2011
fDate
29-31 July 2011
Abstract
The formation of intermetallic mass along the edge of the ball has been observed inherent to the gold bonded Aluminum pads. In a well-bonded sample, it occurs only near the edge of the ball resulting to still strong, reliable bonds after the parts have been exposed at a long duration to elevated temperature. Hence, the presence of intermetallic mass along the periphery of the ball is not an indication of unreliable bond.
Keywords
aluminium; field programmable gate arrays; gold; integrated circuit interconnections; reliability; Au-Al; gold bonded aluminum pads; gold bonding reliability; high density FPGA devices; intermetallic mass; reliable bonds; Gold; Lead; Packaging; Reliability; Silicon; FPGA; Gold Bonding; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and Optoelectronics (ICEOE), 2011 International Conference on
Conference_Location
Dalian
Print_ISBN
978-1-61284-275-2
Type
conf
DOI
10.1109/ICEOE.2011.6013266
Filename
6013266
Link To Document