• DocumentCode
    3211458
  • Title

    Vacuum Pumping Performance Comparison of Non-Evaporable Getter Thin Films Deposited Using Argon and Krypton as Sputtering Gases

  • Author

    Liu, Xianghong ; Adam, Matthew ; He, Yun ; Li, Yulin

  • Author_Institution
    Laboratory for Elementary-Particles Physics, Cornell University, Ithaca NY 14853., xl66@cornell.edu
  • fYear
    2005
  • fDate
    16-20 May 2005
  • Firstpage
    2860
  • Lastpage
    2862
  • Abstract
    Owing to the outstanding vacuum performance and the low secondary electron yield, non-evaporable getter (NEG) thin film deposited onto interior walls has gained widespread acceptance and has been incorporated into many accelerator vacuum system designs. In this paper, the titanium-zirconium-vanadium NEG thin films were deposited onto interior wall of stainless pipes via DC magnetron sputtering method using argon and krypton gas respectively as the sputtering gas. Vacuum pumping evaluation tests were carried out to compare vacuum pumping performances of the Ti-Zr-V NEG thin films deposited using the two rare gases. The results showed much higher initial pumping speed for the Kr-sputtered NEG film than the Ar-sputtered film, though both films have similar activation behavior. Films were also deposited onto silicon wafers under the same experimental conditions, and Rutherford Backscattering Spectrometry (RBS) analysis was carried out to obtain information of the film composition and thickness. The RBS analysis showed that the concentration of argon is significantly higher that of krypton. Insight of the textures of both thin films will be pursued for better understanding of the cause of their difference in pumping performances.
  • Keywords
    Argon; Electron accelerators; Gases; Gettering; Performance evaluation; Semiconductor films; Silicon; Sputtering; Testing; Vacuum systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 2005. PAC 2005. Proceedings of the
  • Print_ISBN
    0-7803-8859-3
  • Type

    conf

  • DOI
    10.1109/PAC.2005.1591294
  • Filename
    1591294