Modeling capacitive links for broadband inter-chip communication

Author

Viitala, Olli ; Flak, Jacek ; Lindfors, Saska

Author_Institution

Helsinki Univ. of Technol., Helsinki

fYear

2007

fDate

19-20 Nov. 2007

Firstpage

1

Lastpage

4

Abstract

This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.

Keywords

broadband networks; crosstalk; digital signal processing chips; flip-chip devices; telecommunication links; wireless sensor networks; adjacent channel; broadband interchip communication; capacitive coupling; capacitive link; close-proximity communication link modeling; crosstalk; electromagnetics simulation; flip-chip arrangement; interchip data transfer; lumped circuit representation; top facing dies; wireless communication; Bonding; Broadband communication; Capacitance; Capacitors; Integrated circuit interconnections; Lead; Manufacturing; Scattering parameters; Semiconductor device modeling; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Norchip, 2007

Conference_Location

Aalborg

Print_ISBN

978-1-4244-1516-8

Electronic_ISBN

978-1-4244-1517-5

Type

conf

DOI

10.1109/NORCHP.2007.4481058

Filename

4481058