• DocumentCode
    3212644
  • Title

    Gate oxide multiple soft breakdown (Multi-SBD) impact on CMOS inverter

  • Author

    Huang, Huey-Ming ; Ko, C.Y. ; Yang, M.L. ; Liao, P.J. ; Wang, J.J. ; Oates, Anthony ; Wu, Kenneth

  • Author_Institution
    Taiwan Semicond. Manuf. Co. Ltd., Hsin-Chu, Taiwan
  • fYear
    2004
  • fDate
    25-29 April 2004
  • Firstpage
    593
  • Lastpage
    594
  • Abstract
    The impact of gate oxide multiple soft breakdown (Multi-SBD) on the performance of CMOS inverter has been demonstrated. The results indicate that the CMOS inverter is still functioning when Multi-SBD event occurs, but noise margin degraded rapidly after extending a period of time. Moreover, off-state leakage current increasing and gate induced drain leakage (GIDL) phenomenon are other concerns. Multi-SBD may be acceptable in reliability viewpoint and the results also imply that we can relax the failure criteria of gate oxide reliability to allow a higher operation voltage, but it must depend on circuit design and application rather for all cases.
  • Keywords
    CMOS integrated circuits; dielectric thin films; integrated circuit reliability; invertors; leakage currents; semiconductor device breakdown; CMOS inverter; circuit design; gate induced drain leakage; gate oxide multiple soft breakdown; gate oxide reliability; higher operation voltage; noise margin; off-state leakage current; Breakdown voltage; CMOS digital integrated circuits; Degradation; Digital circuits; Electric breakdown; Energy consumption; Inverters; Leakage current; MOSFET circuits; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
  • Print_ISBN
    0-7803-8315-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.2004.1315405
  • Filename
    1315405