• DocumentCode
    3212705
  • Title

    FEM electrode refinement for electrical impedance tomography

  • Author

    Grychtol, Bartlomiej ; Adler, Aviv

  • Author_Institution
    Dept. of Med. Phys. in Radiol., German Cancer Res. Center, Heidelberg, Germany
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    6429
  • Lastpage
    6432
  • Abstract
    Electrical Impedance Tomography (EIT) reconstructs images of electrical tissue properties within a body from electrical transfer impedance measurements at surface electrodes. Reconstruction of EIT images requires the solution of an inverse problem in soft field tomography, where a sensitivity matrix, J, of the relationship between internal changes and measurements is calculated, and then a pseudo-inverse of J is used to update the image estimate. It is therefore clear that a precise calculation of J is required for solution accuracy. Since it is generally not possible to use analytic solutions, the finite element method (FEM) is typically used. It has generally been recommended in the EIT literature that FEMs be refined near electrodes, since the electric field and sensitivity is largest there. In this paper we analyze the accuracy requirement for FEM refinement near electrodes in EIT and describe a technique to refine arbitrary FEMs.
  • Keywords
    bioelectric potentials; biological tissues; biomedical electrodes; electric impedance imaging; electric impedance measurement; finite element analysis; image reconstruction; inverse problems; matrix algebra; medical image processing; EIT image reconstruction; FEM electrode refinement; electrical impedance tomography; electrical tissue property; electrical transfer impedance measurement; finite element method; pseudoinverse problem; sensitivity matrix; surface electrode; Accuracy; Current measurement; Electrodes; Finite element analysis; Impedance; Sensitivity; Tomography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6611026
  • Filename
    6611026