• DocumentCode
    3212742
  • Title

    Development of small-sized models of low-cost alumina ceramic pressure-tight housings for ocean-bottom seismometers

  • Author

    Asakawa, Kenichi ; Hyakudome, Tadahiro ; Yoshida, Masao ; Ookubo, Naoyuki

  • Author_Institution
    Japan Agency for Marine-Earth Sci. & Technol., Yokosuka, Japan
  • fYear
    2011
  • fDate
    5-8 April 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Ceramics have some outstanding features needed for pressure-tight housings of underwater devices such as higher compressive strength, lower specific gravity and high resistance against corrosion. One of promising applications is pressure-tight housings for free-fall pop-up Ocean-Bottom Seismometer (OBS) because we can develop light and hard pressure-tight housings using made of ceramics, which have enough buoyancy even for deeper water application. In this paper, the results of Finite Element Method (FEM) analyses and hydraulic pressure tests of a small-sized model of ceramic sphere pressure-tight housings for OBS will be presented. Its rated hydraulic pressure is 80 MPa. In order to reduce the cost of production, we used alumina ceramic rather than silicon nitride ceramic with which we have already developed a ceramic pressure-tight housing for OBS. The results show that using alumina ceramic, we will be able to develop alumina ceramic pressure-tight housings for OBS having high reliability and applicable to deeper water than 8,000 m in depth.
  • Keywords
    alumina; ceramics; finite element analysis; packaging; seismometers; testing; underwater equipment; finite element method; free fall pop up ocean bottom seismometer; hydraulic pressure tests; low cost alumina ceramic pressure tight housing; pressure 80 MPa; Analytical models; Ceramics; Finite element methods; Metals; Safety; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Underwater Technology (UT), 2011 IEEE Symposium on and 2011 Workshop on Scientific Use of Submarine Cables and Related Technologies (SSC)
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4577-0165-8
  • Type

    conf

  • DOI
    10.1109/UT.2011.5774078
  • Filename
    5774078