Title :
Development and use of a miniaturized health monitoring device
Author :
Rouet, Vincent ; Foucher, Bruno
Author_Institution :
EADS CCR, Suresnes, France
Abstract :
A Time Stress Measurement Device is an electronic instrument that records environmental or factual measurements (temperature, relative humidity, shocks, vibrations, on/off, open/closed, voltage, pressure, ...). All these measurements are then dated and stored. Typically, a TSMD is a battery-powered device that is equipped with a microcontroller (for electronic management), memory (for data storage) and sensors (for recordings of environmental data). Most TSMDs use turnkey software on a personal computer to set up and initiate the TSMD as well as retrieve and compute the collected data. TSMD technology is based on embedded or remote environmental stress sensors linked to a microcontroller that controls the sensors (e.g. threshold values), the inputs from the sensors (e.g. sampling frequencies) and the memories (e.g. number and type of recordings). A TSMD provides information for enhanced failure analysis, particularly intermittent failures, and permits trend analysis for preventive maintenance. The aim of using such a device is to determine the impact the environment has on a particular system of interest. The TSMD allows a complete recording of environmental data over time. The scope of the CLIO project is to generalise the TSMD concept, The aim is to develop an autonomous, miniaturised and multi-application TSMD that could be used in civil and military domains.
Keywords :
accelerometers; biosensors; capacitive sensors; electric sensing devices; humidity sensors; semiconductor device reliability; temperature sensors; Time Stress Measurement Device; battery-powered device; data storage; electronic management; environmental stress sensors; memory; microcontroller; miniaturized health monitoring device; sensors; turnkey software; Failure analysis; Humidity measurement; Instruments; Memory management; Microcontrollers; Monitoring; Pressure measurement; Stress measurement; Temperature measurement; Vibration measurement;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
DOI :
10.1109/RELPHY.2004.1315431