• DocumentCode
    3213446
  • Title

    Improvement of carrier power to third-order intermodulation distortion power ratio in CMOS distributed amplifiers

  • Author

    El-Khatib, Ziad ; MacEachern, Leonard ; Mahmoud, Samy A.

  • Author_Institution
    Dept. of Electron., Carleton Univ., Ottawa, ON, Canada
  • fYear
    2008
  • fDate
    14-17 Dec. 2008
  • Firstpage
    98
  • Lastpage
    101
  • Abstract
    The design of a fully-integrated CMOS linearized distributed amplifier (DA) architectures with broadband linearization and a tunable linearity capability for ultra-wideband applications are presented. DA IIP3 linearity is improved by using feedforward, multi-tanh and cross-quad feedback distortion cancellation based CMOS DA gain cells. Simulations were performed in CMOS 0.18 ¿m process technology and the results show that reducing the IMD3 products of the linearized CMOS DA which improves the linearized DA C/IM3 power ratio.
  • Keywords
    CMOS analogue integrated circuits; distributed amplifiers; intermodulation distortion; linearisation techniques; ultra wideband communication; CMOS linearized distributed amplifier; broadband linearization; cross-quad feedback distortion cancellation; feedforward distortion; multitanh distortion; size 0.18 mum; third-order intermodulation distortion power ratio; tunable linearity; ultrawideband applications; CMOS technology; Circuits; Distributed amplifiers; Feedback; Frequency; Intermodulation distortion; Linearity; Linearization techniques; Nonlinear distortion; Ultra wideband technology; CMOS Distributed Amplifier; Carrier Power; Cross-Quad Feedback; Feedforward; Linearization Techniques; Multi-Tanh; Radio Over Fibre; Third-order Intermodulation Distortion Cancellation IMD3; Ultra-WideBand Communications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2008. ICM 2008. International Conference on
  • Conference_Location
    Sharjah
  • Print_ISBN
    978-1-4244-2369-9
  • Electronic_ISBN
    978-1-4244-2370-5
  • Type

    conf

  • DOI
    10.1109/ICM.2008.5393500
  • Filename
    5393500