• DocumentCode
    3213861
  • Title

    Laser induced rear-surface-crack damage properties of HF etched fused silica

  • Author

    Fengrui, Wang ; Jin, Huang ; Hongjie, Liu ; Xinda, Zhou ; Xiaodong, Jiang ; Wu Weidong ; Wanguo, Zheng

  • Author_Institution
    Laser Fusion Res. Center, CAEP, Mianyang, China
  • Volume
    3
  • fYear
    2011
  • fDate
    29-31 July 2011
  • Abstract
    The micro subsurface cracks of fused silica etched with HF solution were observed using AFM and optical microscope, and damage characteristics of crack at each etching state were studied. Experimental results show that inclusions in cracks play a important role in cracks´ damage behavior. After HF etching, inclusions were eliminated completely, configuration was transformed, and the initial damage threshold (IDT) was greatly improved. Experimental results show that HF etching wouldn´t change the damage growth properties of cracks.
  • Keywords
    atomic force microscopy; laser beam effects; laser beam etching; optical microscopy; silicon compounds; surface cracks; AFM; HF etched fused silica; HF etching; HF solution; SiO2; crack damage behavior; crack damage characteristics; crack damage growth properties; etching state; inclusions; initial damage threshold; laser induced rear-surface-crack damage properties; microsubsurface cracks; optical microscope; Etching; Hafnium; Lasers; Microscopy; Optical microscopy; Optical polarization; HF etching; damage property; fused silica; rear-surface crack;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and Optoelectronics (ICEOE), 2011 International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-1-61284-275-2
  • Type

    conf

  • DOI
    10.1109/ICEOE.2011.6013388
  • Filename
    6013388