DocumentCode :
3213861
Title :
Laser induced rear-surface-crack damage properties of HF etched fused silica
Author :
Fengrui, Wang ; Jin, Huang ; Hongjie, Liu ; Xinda, Zhou ; Xiaodong, Jiang ; Wu Weidong ; Wanguo, Zheng
Author_Institution :
Laser Fusion Res. Center, CAEP, Mianyang, China
Volume :
3
fYear :
2011
fDate :
29-31 July 2011
Abstract :
The micro subsurface cracks of fused silica etched with HF solution were observed using AFM and optical microscope, and damage characteristics of crack at each etching state were studied. Experimental results show that inclusions in cracks play a important role in cracks´ damage behavior. After HF etching, inclusions were eliminated completely, configuration was transformed, and the initial damage threshold (IDT) was greatly improved. Experimental results show that HF etching wouldn´t change the damage growth properties of cracks.
Keywords :
atomic force microscopy; laser beam effects; laser beam etching; optical microscopy; silicon compounds; surface cracks; AFM; HF etched fused silica; HF etching; HF solution; SiO2; crack damage behavior; crack damage characteristics; crack damage growth properties; etching state; inclusions; initial damage threshold; laser induced rear-surface-crack damage properties; microsubsurface cracks; optical microscope; Etching; Hafnium; Lasers; Microscopy; Optical microscopy; Optical polarization; HF etching; damage property; fused silica; rear-surface crack;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and Optoelectronics (ICEOE), 2011 International Conference on
Conference_Location :
Dalian
Print_ISBN :
978-1-61284-275-2
Type :
conf
DOI :
10.1109/ICEOE.2011.6013388
Filename :
6013388
Link To Document :
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