DocumentCode
3213861
Title
Laser induced rear-surface-crack damage properties of HF etched fused silica
Author
Fengrui, Wang ; Jin, Huang ; Hongjie, Liu ; Xinda, Zhou ; Xiaodong, Jiang ; Wu Weidong ; Wanguo, Zheng
Author_Institution
Laser Fusion Res. Center, CAEP, Mianyang, China
Volume
3
fYear
2011
fDate
29-31 July 2011
Abstract
The micro subsurface cracks of fused silica etched with HF solution were observed using AFM and optical microscope, and damage characteristics of crack at each etching state were studied. Experimental results show that inclusions in cracks play a important role in cracks´ damage behavior. After HF etching, inclusions were eliminated completely, configuration was transformed, and the initial damage threshold (IDT) was greatly improved. Experimental results show that HF etching wouldn´t change the damage growth properties of cracks.
Keywords
atomic force microscopy; laser beam effects; laser beam etching; optical microscopy; silicon compounds; surface cracks; AFM; HF etched fused silica; HF etching; HF solution; SiO2; crack damage behavior; crack damage characteristics; crack damage growth properties; etching state; inclusions; initial damage threshold; laser induced rear-surface-crack damage properties; microsubsurface cracks; optical microscope; Etching; Hafnium; Lasers; Microscopy; Optical microscopy; Optical polarization; HF etching; damage property; fused silica; rear-surface crack;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and Optoelectronics (ICEOE), 2011 International Conference on
Conference_Location
Dalian
Print_ISBN
978-1-61284-275-2
Type
conf
DOI
10.1109/ICEOE.2011.6013388
Filename
6013388
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