Microsystems for three axis active fiber alignment

Author

Wood, R.L. ; Dhuler, V.R. ; Haake, J.M. ; Cowen, A.B.

Author_Institution

MCNC, Research Triangle Park, NC, USA

fYear

1998

fDate

20-24 July 1998

Abstract

We report on development of novel microsystems capable of three-axis active in-package fiber alignment with submicron tolerances. Existing procedures for aligning fiber optics and micro-optics are very labor and capital intensive. The packaging of individual single mode opto-electronic components currently dominates the photonic device product cost, limiting their implementation in the market place. Solutions for passive alignments with tolerances of few microns (not adequate for single mode coupling) have been demonstrated. Microsystems presented here are batch fabricated using a combination of silicon micromachining and LIGA.

Keywords

LIGA; micro-optics; micromachining; micromechanical devices; optical communication equipment; optical fabrication; optical fibre couplers; packaging; LIGA; capital intensive; fiber optics alignment; individual single mode opto-electronic components; market place; micro optics; packaging; photonic device product cost; silicon micromachining; single mode coupling; submicron tolerances; three axis active fiber alignment microsystems; three-axis active in-package fiber alignment; Actuators; Counting circuits; Etching; Micromechanical devices; Nickel; Optical fiber devices; Optical fiber testing; Semiconductor device measurement; Silicon; Springs;

fLanguage

English

Publisher

ieee

Conference_Titel

Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-4953-9

Type

conf

DOI

10.1109/LEOSST.1998.689726

Filename

689726