DocumentCode
3214156
Title
Low Cost, Tailored Polymer-Metal Nanocomposites for Advanced Electronic Applications
Author
Biswas, Abhijit ; Karulkar, Pramod C.
Author_Institution
Alaska Univ., Fairbanks
fYear
2006
fDate
25-28 June 2006
Firstpage
145
Lastpage
149
Abstract
The primary purpose of this paper is to introduce a nanomaterials fabrication facility that has recently been set up at the University of Alaska Fairbanks´ Office of Electronic Miniaturization (OEM). The secondary purpose is to outline our research programs on nanoengineered materials for advanced electronic applications. We present a versatile, simple, and single-step high-vacuum e-beam codeposition technique for the controlled fabrication of nanostructured materials. The method allows evaporation of up to four different polymers, metals, semiconductors, insulators, and ceramics simultaneously or sequentially. Film properties can be controlled by controlling a number of deposition conditions. The system can be switched over rapidly to use a different set of materials. The process has a great potential to produce materials for many different practical applications for both R&D and scaled-up pilot production. This is the first nanomaterial fabrication facility of its kind in the State of Alaska and provides exciting opportunities for university-government- industry-collaboration that will be highlighted.
Keywords
electron beam deposition; evaporation; nanocomposites; nanoelectronics; polymers; advanced electronic applications; film properties; high-vacuum e-beam codeposition technique; nanoengineered materials; nanomaterial fabrication facility; nanostructured materials; polymer-metal nanocomposites; Ceramics; Costs; Fabrication; Metal-insulator structures; Nanocomposites; Nanomaterials; Nanostructured materials; Plastic insulation; Polymers; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
University/Government/Industry Microelectronics Symposium, 2006 16th Biennial
Conference_Location
San Jose, CA
ISSN
0749-6877
Print_ISBN
1-4244-0267-0
Type
conf
DOI
10.1109/UGIM.2006.4286370
Filename
4286370
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