DocumentCode
3214196
Title
Multilevel Metal Interconnect For VLSI Circuits Using Polyimide Dielectrics
Author
Wade, Thomas E.
Author_Institution
Mississippi State University
fYear
1981
fDate
5-8 April 1981
Firstpage
12
Lastpage
16
Keywords
Aluminum; Conductors; Dielectric thin films; Dielectrics and electrical insulation; Integrated circuit interconnections; Plasma properties; Plasma temperature; Polyimides; Silicon; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Southeastcon '81. Conference Proceedings
Conference_Location
Huntsville, AL, USA
Type
conf
DOI
10.1109/SECON.1981.673389
Filename
673389
Link To Document