• DocumentCode
    321522
  • Title

    Static and dynamic characteristics of 4H-SiC p+n and 6H-SiC Schottky diodes

  • Author

    Tolkkinen, Les E. ; Ramalingam, Mysore L. ; Tunstall, Chris

  • Author_Institution
    Wright Lab., Wright-Patterson AFB, OH, USA
  • Volume
    1
  • fYear
    1997
  • fDate
    27 Jul-1 Aug 1997
  • Firstpage
    312
  • Abstract
    Wide-bandgap (WBG) semiconductor power devices have good potential for operating at higher temperatures compared to Si-based electronics. Silicon carbide (SiC) currently represents a good WBG candidate for use in developing power MOSFETs and Schottky diodes used in power conditioning and control electronics that are required for the next generation More Electric Aircraft (MEA). To that end, SiC Schottky and p +n diodes were examined; the SiC Schottky diode is important for use in power switching applications due to its fast reverse recovery times. Faster switching times lead to lower power losses, which in turn dissipates less heat. The SiC p+n diode is the basic voltage blocking structure in the SiC MOSFET. Forward and reverse bias static and dynamic characteristics were obtained for 4H-SiC p+n diodes in vacuum at temperatures in the range of 298 K to 698 K. Static characteristics revealed a decrease in forward threshold voltage from 2 volts at ~298 K to 1.25 volts at 698 K; similar behavior was also observed for 6H-SiC Schottky diodes as a function of temperature. Dynamic measurements yielded low frequency (100 KHz) rectifier efficiencies of ~38% for the SiC Schottky diodes over the temperature range ~298 K -273 K, compared to ~34% for the SiC p+n diodes. Data was also obtained for diode power dissipation versus duty cycle and temperature. It is believed that an error exists in the authors´ experimental setup for power dissipation
  • Keywords
    Schottky diodes; aircraft; power MOSFET; power semiconductor diodes; power supplies to apparatus; semiconductor device testing; silicon compounds; 1.25 V; 2 V; 298 to 698 K; 34 percent; 38 percent; More Electric Aircraft; Schottky diodes; SiC; diode power dissipation; duty cycle; dynamic characteristics; dynamic measurements; power MOSFETs; power dissipation; power switching applications; reverse recovery times; static characteristics; switching time; temperature; wide-bandgap power semiconductor devices; Aerospace control; Aerospace electronics; Aircraft; MOSFETs; Power conditioning; Power dissipation; Schottky diodes; Semiconductor diodes; Silicon carbide; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    0-7803-4515-0
  • Type

    conf

  • DOI
    10.1109/IECEC.1997.659205
  • Filename
    659205