DocumentCode :
321522
Title :
Static and dynamic characteristics of 4H-SiC p+n and 6H-SiC Schottky diodes
Author :
Tolkkinen, Les E. ; Ramalingam, Mysore L. ; Tunstall, Chris
Author_Institution :
Wright Lab., Wright-Patterson AFB, OH, USA
Volume :
1
fYear :
1997
fDate :
27 Jul-1 Aug 1997
Firstpage :
312
Abstract :
Wide-bandgap (WBG) semiconductor power devices have good potential for operating at higher temperatures compared to Si-based electronics. Silicon carbide (SiC) currently represents a good WBG candidate for use in developing power MOSFETs and Schottky diodes used in power conditioning and control electronics that are required for the next generation More Electric Aircraft (MEA). To that end, SiC Schottky and p +n diodes were examined; the SiC Schottky diode is important for use in power switching applications due to its fast reverse recovery times. Faster switching times lead to lower power losses, which in turn dissipates less heat. The SiC p+n diode is the basic voltage blocking structure in the SiC MOSFET. Forward and reverse bias static and dynamic characteristics were obtained for 4H-SiC p+n diodes in vacuum at temperatures in the range of 298 K to 698 K. Static characteristics revealed a decrease in forward threshold voltage from 2 volts at ~298 K to 1.25 volts at 698 K; similar behavior was also observed for 6H-SiC Schottky diodes as a function of temperature. Dynamic measurements yielded low frequency (100 KHz) rectifier efficiencies of ~38% for the SiC Schottky diodes over the temperature range ~298 K -273 K, compared to ~34% for the SiC p+n diodes. Data was also obtained for diode power dissipation versus duty cycle and temperature. It is believed that an error exists in the authors´ experimental setup for power dissipation
Keywords :
Schottky diodes; aircraft; power MOSFET; power semiconductor diodes; power supplies to apparatus; semiconductor device testing; silicon compounds; 1.25 V; 2 V; 298 to 698 K; 34 percent; 38 percent; More Electric Aircraft; Schottky diodes; SiC; diode power dissipation; duty cycle; dynamic characteristics; dynamic measurements; power MOSFETs; power dissipation; power switching applications; reverse recovery times; static characteristics; switching time; temperature; wide-bandgap power semiconductor devices; Aerospace control; Aerospace electronics; Aircraft; MOSFETs; Power conditioning; Power dissipation; Schottky diodes; Semiconductor diodes; Silicon carbide; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-4515-0
Type :
conf
DOI :
10.1109/IECEC.1997.659205
Filename :
659205
Link To Document :
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