A numerical method for resistance extraction of conductors with patered cross section and random rough surface

Interconnect play a crucial role in integrated circuit. As such, accurate interconnect modeling and characterization are key to the design and verification of integrated circuit. Copper (Cu) has became a mainstream material for interconnects and Cu interconnects are generally formed using the “dual damascene” process which cause the shape of line irregular. The paper analysis the impact of conductor surface roughness and the tapered line shape on the resistance of interconnects. In order to quantify these effects on the interconnect performance we develop the boundary elemental method (BEM) to calculate the frequency-dependent resistance. The results demonstrate that dimensions, RMS and the correlation length are important factors impacting on the variation of interconnect resistance.