Title :
Fast Thermal Models for Power Device Packaging
Author :
Swan, I.R. ; Bryant, A.T. ; Mawby, P.A.
Author_Institution :
Sch. of Eng., Univ. of Warwick, Coventry
Abstract :
This paper describes the development and implementation of an analytical thermal model for fast and accurate thermal simulations of power device modules. A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the structure versus time. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink. The model has been validated against FEM simulations and the difference between the two models has been illustrated. The required aspects of heat diffusion are captured successfully by the Fourier-based model.
Keywords :
Fourier series; equivalent circuits; power semiconductor devices; semiconductor device packaging; thermal management (packaging); Fourier series; IGBT; fast thermal models; power device modules; power device packaging; Analytical models; Circuit simulation; Computational modeling; Electronic packaging thermal management; Equations; Fourier series; Insulated gate bipolar transistors; Integrated circuit packaging; Mathematical model; Thermal engineering;
Conference_Titel :
Industry Applications Society Annual Meeting, 2008. IAS '08. IEEE
Conference_Location :
Edmonton, Alta.
Print_ISBN :
978-1-4244-2278-4
Electronic_ISBN :
0197-2618
DOI :
10.1109/08IAS.2008.359
