Fast Thermal Models for Power Device Packaging

Author

Swan, I.R. ; Bryant, A.T. ; Mawby, P.A.

Author_Institution

Sch. of Eng., Univ. of Warwick, Coventry

fYear

2008

fDate

5-9 Oct. 2008

Firstpage

1

Lastpage

8

Abstract

This paper describes the development and implementation of an analytical thermal model for fast and accurate thermal simulations of power device modules. A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the structure versus time. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink. The model has been validated against FEM simulations and the difference between the two models has been illustrated. The required aspects of heat diffusion are captured successfully by the Fourier-based model.

Keywords

Fourier series; equivalent circuits; power semiconductor devices; semiconductor device packaging; thermal management (packaging); Fourier series; IGBT; fast thermal models; power device modules; power device packaging; Analytical models; Circuit simulation; Computational modeling; Electronic packaging thermal management; Equations; Fourier series; Insulated gate bipolar transistors; Integrated circuit packaging; Mathematical model; Thermal engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Society Annual Meeting, 2008. IAS '08. IEEE

Conference_Location

Edmonton, Alta.

ISSN

0197-2618

Print_ISBN

978-1-4244-2278-4

Electronic_ISBN

0197-2618

Type

conf

DOI

10.1109/08IAS.2008.359

Filename

4659147