An advanced packaging technology for high performance power devices

Author

Ozmat, B. ; Temple, V.A.K. ; Azotea, J.K.

Author_Institution

Harris Semicond., Latham, NY, USA

Volume

1

fYear

1997

fDate

27 Jul-1 Aug 1997

Firstpage

687

Abstract

Packaging related performance and reliability aspects of the advanced power modules were discussed. A new approach for the packaging of high performance power devices for both commercial and military applications was introduced. The resistance of device package was modeled. The results of closed form solutions and finite element analysis (FEA) were presented. The metalization and patterning of the first level package was discussed. The thermal performance of a typical power module with various heat spreader materials and configurations was analyzed by using 3D FEA techniques

Keywords

finite element analysis; packaging; power electronics; reliability; semiconductor device metallisation; 3D FEA techniques; advanced power modules; closed form solutions; commercial applications; device package resistance modeling; finite element analysis; heat spreader materials; high performance power devices; metalization; military applications; packaging technology; patterning; reliability; thermal performance; Anodes; Bonding; Circuits; Lead; Multichip modules; Semiconductor device packaging; Semiconductor device reliability; Thermal conductivity; Thyristors; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety

Conference_Location

Honolulu, HI

Print_ISBN

0-7803-4515-0

Type

conf

DOI

10.1109/IECEC.1997.659273

Filename

659273