• DocumentCode
    3216025
  • Title

    Interconnect design for deep submicron ICs

  • Author

    Cong, J. ; Zhigang Pan ; Lei He ; Cheng-Kok Koh ; Kei-Yong Khoo

  • Author_Institution
    Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
  • fYear
    1997
  • fDate
    9-13 Nov. 1997
  • Firstpage
    478
  • Lastpage
    485
  • Abstract
    Interconnect has become the dominating factor in determining circuit performance and reliability in deep submicron designs. In this embedded tutorial, we first discuss the trends and challenges of interconnect design as the technology feature size rapidly decreases towards below 0.1 micron. Then, we present commonly used interconnect models and a set of interconnect design and optimization techniques for improving interconnect performance and reliability. Finally, we present comparisons of different optimization techniques in terms of their efficiency and optimization results, and show the impact of these optimization techniques on interconnect performance in each technology generation from the 0.35 /spl mu/m to 0.07 /spl mu/m projected in the National Technology Roadmap for Semiconductors.
  • Keywords
    circuit CAD; integrated circuit interconnections; 0.07 micron; 0.1 micron; 0.35 micron; circuit performance; deep submicron ICs; interconnect design; interconnect models; optimization; reliability; Integrated circuit interconnections;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1997. Digest of Technical Papers., 1997 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1092-3152
  • Print_ISBN
    0-8186-8200-0
  • Type

    conf

  • DOI
    10.1109/ICCAD.1997.643579
  • Filename
    643579