• DocumentCode
    3216473
  • Title

    Global interconnect sizing and spacing with consideration of coupling capacitance

  • Author

    Cong, J. ; Lei He ; Cheng-Kok Koh ; Zhigang Pan

  • Author_Institution
    Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
  • fYear
    1997
  • fDate
    9-13 Nov. 1997
  • Firstpage
    628
  • Lastpage
    633
  • Abstract
    The paper presents an efficient approach to perform global interconnect sizing and spacing (GISS) for multiple nets to minimize interconnect delays with consideration of coupling capacitance, in addition to area and fringing capacitances. We introduce the formulation of symmetric and asymmetric wire sizing and spacing. We prove two important results on the symmetric and asymmetric effective fringing properties which lead to a very effective bound computation algorithm to compute the upper and lower bounds of the optimal wire sizing and spacing solution for all nets under consideration. Our experiments show that in most cases the upper and lower bounds meet quickly after a few iterations and we actually obtain the optimal solution. To our knowledge, this is the first in depth study of global wire sizing and spacing for multiple nets with consideration of coupling capacitance. Experimental results show that our GISS solutions lead to substantially better delay reduction than existing single net wire sizing solutions without consideration of coupling capacitance.
  • Keywords
    VLSI; circuit CAD; delays; interconnected systems; minimisation; GISS solutions; asymmetric wire sizing; coupling capacitance; delay reduction; fringing capacitances; global interconnect sizing and spacing; global wire sizing; interconnect delay minimization; multiple nets; optimal wire sizing; spacing solution; symmetric effective fringing properties; Very-large-scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1997. Digest of Technical Papers., 1997 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1092-3152
  • Print_ISBN
    0-8186-8200-0
  • Type

    conf

  • DOI
    10.1109/ICCAD.1997.643604
  • Filename
    643604