DocumentCode
3216734
Title
Preparation of plasma-sprayed oxide cathode
Author
Min Zhang ; Xiaoxia Wang ; Jirun Luo ; Qinglan Zhao
Author_Institution
Key Lab. of High Power Microwave Sources & Technol., Chinese Acad. of Sci., Beijing, China
fYear
2010
fDate
14-16 Oct. 2010
Firstpage
510
Lastpage
511
Abstract
In the conventional oxide cathode manufacturing process, a BaSrCa(CO3) layer is either painted or sprayed on the Ni base under the normal temperature after the carbonate powders have been mixed with a nitrocellulose binder to provide adhesion to the nickel surface. However, the byproducts deposited in the coating of oxide cathode in the decomposing process and relatively weak adhesion resulting from this method may reduce the emission performance of oxide cathode.In order to improve its performance, plasma spraying has been applied to oxide cathode. Plasma spraying produces a high quality coating by combining a high temperature, a relatively inert spraying medium with high particle velocities. It is shown that few byproducts such as C or CO2 are produced in the coating in the decomposing process, and that a firmer and denser oxides coating is formed on the oxide cathode surface.
Keywords
barium compounds; calcium compounds; electron field emission; nickel; oxide coated cathodes; plasma arc sprayed coatings; plasma arc spraying; strontium compounds; vacuum microelectronics; BaSrCa(CO3); BaSrCa(CO3) layer; Ni; byproducts; carbonate powders; conventional oxide cathode manufacturing process; decomposing process; emission performance; high particle velocities; high quality coating; mixing; nickel surface; nitrocellulose binder; normal temperature; oxide cathode coating; oxide cathode surface; oxide coating; painting; plasma spraying; plasma-sprayed oxide cathode; relatively inert spraying medium; relatively weak adhesion; Furnaces;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electron Sources Conference and Nanocarbon (IVESC), 2010 8th International
Conference_Location
Nanjing
Print_ISBN
978-1-4244-6645-0
Type
conf
DOI
10.1109/IVESC.2010.5644228
Filename
5644228
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