DocumentCode
3216769
Title
Interconnect layout optimization under higher-order RLC model
Author
Cong, J. ; Cheng-Kok Koh
Author_Institution
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
fYear
1997
fDate
9-13 Nov. 1997
Firstpage
713
Lastpage
720
Abstract
Studies the interconnect layout optimization problem under a higher-order RLC model to optimize not just the delay but also the waveform for RLC circuits with non-monotone signal response. We propose a unified approach that considers topology optimization, wire-sizing optimization and waveform optimization simultaneously. Our algorithm considers a large class of routing topologies, ranging from shortest-path Steiner trees to bounded-radius Steiner trees and Steiner routings. We construct a set of required-arrival-time Steiner (RATS) trees, providing a smooth trade-off among signal delay, waveform and routing area. Using a new incremental moment computation algorithm, we interleave topology construction with moment computation to facilitate accurate delay calculation and evaluation of waveform quality. Experimental results show that our algorithm is able to construct a set of topologies providing a smooth trade-off among signal delay, signal settling time, voltage overshoot and routing cost.
Keywords
circuit layout CAD; circuit optimisation; delays; network routing; network topology; signal synthesis; trees (mathematics); waveform analysis; RATS trees; Steiner routings; bounded-radius Steiner trees; delay optimization; higher-order RLC model; incremental moment computation algorithm; interconnect layout optimization; nonmonotone signal response; required-arrival-time Steiner trees; resistance-inductance-capacitance circuits; routing area; routing cost; routing topologies; shortest-path Steiner trees; signal delay; signal settling time; topology optimization; voltage overshoot; waveform optimization; waveform quality evaluation; wire-sizing optimization; RLC circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 1997. Digest of Technical Papers., 1997 IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
ISSN
1092-3152
Print_ISBN
0-8186-8200-0
Type
conf
DOI
10.1109/ICCAD.1997.643617
Filename
643617
Link To Document