Steady-state and transient temperature distribution in GaAs microwave circuits

This work models and simulates the electrothermal properties of GaAs pHEMT based Monolithic Microwave Integrated Circuits (MMIC). The temperature increase of each component due to the self heating of the power devices in the packages was simulated coupled with the static electromagnetic analysis. A linear RC thermal macromodel was developed for the die, and the temperatures are solved by using nodal equations numerically. Stead-state and transient simulations of temperature distribution of the MMIC structures were performed. The need for thermal vias was demonstrated as essential parts of the package for thermal cooling purposes.