DocumentCode :
321908
Title :
Parasitic heat loss reduction in AMTEC cells by heat shield optimization
Author :
Borkowski, C.A. ; Svedberg, R.C. ; Hendricks, T.J.
Author_Institution :
Adv. Modular Power Syst. Inc., Ann Arbor, MI, USA
fYear :
1997
fDate :
27 Jul-1 Aug 1997
Firstpage :
1130
Abstract :
Alkali metal thermal to electric conversion (AMTEC) cell performance can be increased by the proper design of thermal radiative shielding internal to the AMTEC cell. These heat shields essentially lower the radiative heat transfer between the heat input zone of the cell and the heat rejection zone of the cell. In addition to lowering the radiative heat transfer between the heat input and heat rejection surfaces of the cell, the shields raise the AMTEC cell performance by increasing the temperature of the beta´´ alumina solid electrolyte (BASE). This increase in temperature of the BASE tube allows the evaporator temperature to be increased without sodium condensing within the BASE tubes. Experimental testing and theoretical analysis have been performed to compare the relative merits of two candidate heat shield packages: 1) chevron, and 2) cylindrical heat shields. These two heat shield packages were compared to each other and a baseline cell which had no heat shields installed. For the two heat shield packages, the reduction in total heat transfer is between 17% to 27% for the heat input surface temperature varying from 700°C, 750°C, and 800°C with the heat rejection surface temperature kept at 300°C
Keywords :
alumina; heat losses; heat radiation; shielding; solid electrolytes; thermoelectric conversion; thermoelectric devices; 300 C; 700 C; 750 C; 800 C; AMTEC cells; alkali metal thermal to electric conversion; beta´´ alumina solid electrolyte; chevron; cylindrical heat shields; evaporator temperature; heat input surface; heat input surface temperature; heat input zone; heat rejection surface; heat rejection surface temperature; heat rejection zone; heat shield optimization; parasitic heat loss reduction; radiative heat transfer reduction; temperature increase; thermal radiative shielding; Conducting materials; Heat transfer; Packaging; Performance analysis; Performance evaluation; Power systems; Solids; Temperature control; Temperature distribution; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-4515-0
Type :
conf
DOI :
10.1109/IECEC.1997.661929
Filename :
661929
Link To Document :
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