• DocumentCode
    321938
  • Title

    Steady state analysis of the USAF Phillips Laboratory Capillary Pumped Loop Testbed

  • Author

    Tomlinson, Benny Joe, Jr.

  • Author_Institution
    Phillips Lab., Albuquerque, NM, USA
  • fYear
    1997
  • fDate
    27 Jul-1 Aug 1997
  • Firstpage
    1397
  • Abstract
    A steady state thermal and pressure drop model for a capillary pumped loop (CPL) was created in an effort to begin the characterization of the Capillary Pumped Loop Testbed at Phillips Laboratory. This model is an adaptation of an existing model for the loop heat pipe (LHP), and serves to calculate flow rates, temperatures, thermodynamic fluid conditions, and pressure drops throughout the system. The developed model can accommodate one or two evaporators and one condenser. Comparison to measured data from the testbed shows the model as a satisfactory prediction tool for temperature distribution, but fails to adequately predict the pressure drops encountered in the system. Recommendations are given to further analyze the heat transfer conductances in the evaporator and condenser using a more sophisticated calculation/model, and include a more sophisticated model of the pressure drop mechanisms
  • Keywords
    condensation; evaporation; heat pipes; heat transfer; pipe flow; temperature distribution; thermodynamic properties; USAF Phillips Laboratory Capillary Pumped Loop Testbed; condenser; evaporators; flow rates calculation; heat transfer conductances; loop heat pipe calculation; pressure drops calculation; steady state analysis; temperature distribution; temperatures calculation; thermodynamic fluid conditions calculation; Adaptation model; Heat transfer; Laboratories; Predictive models; Pressure measurement; Pumps; Steady-state; System testing; Temperature distribution; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    0-7803-4515-0
  • Type

    conf

  • DOI
    10.1109/IECEC.1997.661974
  • Filename
    661974