DocumentCode :
321938
Title :
Steady state analysis of the USAF Phillips Laboratory Capillary Pumped Loop Testbed
Author :
Tomlinson, Benny Joe, Jr.
Author_Institution :
Phillips Lab., Albuquerque, NM, USA
fYear :
1997
fDate :
27 Jul-1 Aug 1997
Firstpage :
1397
Abstract :
A steady state thermal and pressure drop model for a capillary pumped loop (CPL) was created in an effort to begin the characterization of the Capillary Pumped Loop Testbed at Phillips Laboratory. This model is an adaptation of an existing model for the loop heat pipe (LHP), and serves to calculate flow rates, temperatures, thermodynamic fluid conditions, and pressure drops throughout the system. The developed model can accommodate one or two evaporators and one condenser. Comparison to measured data from the testbed shows the model as a satisfactory prediction tool for temperature distribution, but fails to adequately predict the pressure drops encountered in the system. Recommendations are given to further analyze the heat transfer conductances in the evaporator and condenser using a more sophisticated calculation/model, and include a more sophisticated model of the pressure drop mechanisms
Keywords :
condensation; evaporation; heat pipes; heat transfer; pipe flow; temperature distribution; thermodynamic properties; USAF Phillips Laboratory Capillary Pumped Loop Testbed; condenser; evaporators; flow rates calculation; heat transfer conductances; loop heat pipe calculation; pressure drops calculation; steady state analysis; temperature distribution; temperatures calculation; thermodynamic fluid conditions calculation; Adaptation model; Heat transfer; Laboratories; Predictive models; Pressure measurement; Pumps; Steady-state; System testing; Temperature distribution; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-4515-0
Type :
conf
DOI :
10.1109/IECEC.1997.661974
Filename :
661974
Link To Document :
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