Research on the high-speed pick and place device for die bonders

Die bonding is a very important process of IC packaging. The quality of the die bonding depends on the speed, accuracy, and precision of the pick and place movement. In order to design a better P&P device, this research firstly studied the related patents and literatures, and then cooperated with one company to gain more practical experience. Furthermore, the research applied the TRIZ theory to get innovative ideas for conceptual design. This research finally developed a high speed, stable P&P device using the slider-crank mechanism. The idea is to design an additional buffer device on the slider part. Using this device, the bond head can stay on the tops of the pick and place positions for a short period without stopping the motor, the vibration of the mechanism can be greatly reduced, and the positioning precision can be increased. To verify the design, the research has built a prototype of the P&P mechanism. The experiment results show that the mechanism can reach a speed of 8000UPH, and its positioning precision and repeatability are kept inside 0.05mm.