MEMS-microfabricated components for millimeter-wave and THz TWTs

Author

Welter, John ; Booske, John ; Jiang, Hongrui ; Bhattacharjee, Sudeep ; Limbach, Steve ; Van der Weide, Dan ; Zhang, Ning ; Scharer, John ; Genack, Matt ; Mashal, A. ; Kory, Carol ; Ives, Lawrence ; Read, Mike

Author_Institution

Electr. & Comput. Eng. Dept., Wisconsin Univ., Madison, WI, USA

fYear

2004

fDate

27-29 April 2004

Firstpage

258

Abstract

Summary form only given. Microfabrication techniques used for MEMS offer promising advantages for fabrication of mm-wave and THz vacuum electronic devices (μVEDs). This paper describes results of an exploratory investigation of several microfabrication methods considered candidates for production of circuits or circuit components for mm-wave and THz TWTs. The processes investigated have included LIGA, hot embossing (polymer micromolding), and deep reactive ion etching (DRIE). The circuits and circuit components investigated have included folded waveguides (FWGs), gratings, resistive wall amplifiers, and novel attenuators for FWG TWTs. We present and discuss the results of the microfabrication experiments, the design analyses, and their implications for advanced mm-wave and THz μVEDs.

Keywords

LIGA; embossing; micromechanical devices; millimetre wave tubes; moulding; sputter etching; submillimetre wave tubes; travelling wave tubes; μVED; DRIE; FWG TWT; LIGA; MEMS-microfabricated components; THz vacuum electronic devices; attenuators; deep reactive ion etching; folded waveguides; gratings; hot embossing; mm-wave TWT; polymer micromolding; resistive wall amplifiers; Embossing; Etching; Fabrication; Micromechanical devices; Millimeter wave circuits; Millimeter wave technology; Polymers; Production; Vacuum technology; Waveguide components;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Electronics Conference, 2004. IVEC 2004. Fifth IEEE International

Print_ISBN

0-7803-8261-7

Type

conf

DOI

10.1109/IVELEC.2004.1316303

Filename

1316303