A signal conditioner for high-frequency inductive position sensors

The use of integrated circuit techniques in position sensing applications can offer significant advantages over discrete component solutions, such as miniaturization, reduced cost, increased reliability and enhanced sensitivity. We realized a signal conditioner that includes an application specific integrated circuit (ASIC) and an external microcontroller for readout and control of non-contact high-frequency inductive position sensors. Both the system architecture and details on the key blocks are described. The ASIC was designed in a 0.6-¿m CMOS process technology and preliminary measured results are presented. The signal conditioner architecture is universal and can be used for other sensor types such as LVDTs.