Title :
Morphology, growth and size distribution of Cu6Sn5 intermetallic compound by flux-driven ripening at SnPb solder and Cu interface
Author :
Suh, J.O. ; Tu, K.N. ; Gusak, A.M.
Author_Institution :
Dept. of Mater. Sci. & Eng., UCLA, Los Angeles, CA, USA
Abstract :
The size distribution and growth of scallop-type Cu6Sn5 intermetallic compound at the interface between molten SnPb solder and Cu was investigated, along with morphological change of Cu6Sn5 according to SnPb solder composition. Cu6Sn5 showed round scallop-type morphology when SnPb solder composition was from eutectic (63Sn37Pb) to about 40Sn60Pb. In other compositions, the intermetallic compounds showed faceted morphology. This change of morphology is due to variation of interfacial energy with solder composition. The scallop growth rate is proportional to cube root of time, and size distribution is in good agreement with the flux-driven-ripening (FDR) theory. Comparison with other works showed that intermetallic compound scallops with shape close to hemisphere give better agreement with the FDR theory.
Keywords :
copper alloys; crystal growth; crystal morphology; interface structure; lead alloys; solders; tin alloys; Cu6Sn5; FDR theory; SnPb; crystal growth; crystal morphology; flux-driven ripening; interfacial energy; intermetallic compound; scallop growth rate; scallop-type morphology; size distribution; solder composition; Flip chip solder joints; Intermetallic; Lead; Materials science and technology; Metallization; Morphology; Physics; Shape; Soldering; Tin;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2005.1432040
