• DocumentCode
    3219929
  • Title

    No-bleed die attach adhesives

  • Author

    Neff, B. ; Huneke, J. ; Nguyen, M. ; Liu, P. ; Herrington, T. ; Gupta, S.K.

  • Author_Institution
    HENKEL Corp., Irvine, CA, USA
  • fYear
    2005
  • fDate
    16-18 March 2005
  • Firstpage
    79
  • Lastpage
    81
  • Abstract
    Resin bleed out (RBO) is a major problem encountered when using die attach adhesives on metal or organic substrates or on top of another die. RBO to the edge of the substrate and/or onto the wire-bonding pad on a die, contaminates these surfaces. This hinders the formation of good wire-bonds between the die-top and the substrate or the wire-bonding fingers. The issue of resin bleed was tackled in three steps: First - understanding the nature of the surface (e.g. surface energy, roughness), and resin properties (e.g. viscosity, molecular weight, surface tension, polarity). Second - modelling the effect of the surface and liquid properties (input), on the adhesive performance (output). Third - design and develop new resins, based on the analysis, to reduce and eliminate resin bleed.
  • Keywords
    adhesives; lead bonding; resins; adhesive performance; liquid properties; metal substrates; no-bleed die attach adhesives; organic substrates; resin bleed out; resin properties; wire-bonding pad; Fingers; Lead; Microassembly; Ovens; Packaging; Resins; Rough surfaces; Surface contamination; Surface roughness; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
  • ISSN
    1550-5723
  • Print_ISBN
    0-7803-9085-7
  • Electronic_ISBN
    1550-5723
  • Type

    conf

  • DOI
    10.1109/ISAPM.2005.1432051
  • Filename
    1432051