DocumentCode :
3219929
Title :
No-bleed die attach adhesives
Author :
Neff, B. ; Huneke, J. ; Nguyen, M. ; Liu, P. ; Herrington, T. ; Gupta, S.K.
Author_Institution :
HENKEL Corp., Irvine, CA, USA
fYear :
2005
fDate :
16-18 March 2005
Firstpage :
79
Lastpage :
81
Abstract :
Resin bleed out (RBO) is a major problem encountered when using die attach adhesives on metal or organic substrates or on top of another die. RBO to the edge of the substrate and/or onto the wire-bonding pad on a die, contaminates these surfaces. This hinders the formation of good wire-bonds between the die-top and the substrate or the wire-bonding fingers. The issue of resin bleed was tackled in three steps: First - understanding the nature of the surface (e.g. surface energy, roughness), and resin properties (e.g. viscosity, molecular weight, surface tension, polarity). Second - modelling the effect of the surface and liquid properties (input), on the adhesive performance (output). Third - design and develop new resins, based on the analysis, to reduce and eliminate resin bleed.
Keywords :
adhesives; lead bonding; resins; adhesive performance; liquid properties; metal substrates; no-bleed die attach adhesives; organic substrates; resin bleed out; resin properties; wire-bonding pad; Fingers; Lead; Microassembly; Ovens; Packaging; Resins; Rough surfaces; Surface contamination; Surface roughness; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
ISSN :
1550-5723
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
Type :
conf
DOI :
10.1109/ISAPM.2005.1432051
Filename :
1432051
Link To Document :
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