DocumentCode
3219974
Title
Grinding performance analysis of diamond wheel for groove grinding
Author
Lin, Wei-Shin ; Wang, Yung-Cheng ; Hsiao, Wen-Chi ; Lee, Bean-Yin
Author_Institution
Dept. of Mech. & Comput.-Aided Eng., Nat. Formosa Univ., Huwei, Taiwan
fYear
2010
fDate
9-11 June 2010
Firstpage
608
Lastpage
613
Abstract
This study utilized sintered tungsten carbide-based hard metals (HRA 92.3 and referred to as tungsten carbide or WC hereinafter) as the workpiece, testing and comparing the performance of each diamond wheel. The experiment was to cut the groove of a double-end mill and the cut behavior was creep feed grinding. Grinding resistance and power could serve as the index for cutting performance, surface roughness could serve as the index for accuracy, and grinding ratio could serve as the index for wheel service life. Through different wheels under specific combined conditions, this paper analyzed the wheel grinding resistance, surface quality of the tool, and the grinding wheel service life. After comprehensive analysis, diamond wheels made domestically could be considered to be used for grinding end mill groove since its performance on any aspect was not inferior to those made in foreign countries.
Keywords
creep; diamond; grinding; milling; surface roughness; wheels; comprehensive analysis; creep feed grinding; cutting performance; diamond wheel; diamond wheels; double-end mill; grinding performance analysis; grinding resistance; groove grinding; sintered tungsten carbide-based hard metals; surface roughness; Creep; Milling machines; Optical wavelength conversion; Performance analysis; Rough surfaces; Surface resistance; Surface roughness; Testing; Tungsten; Wheels; creep feed grinding; diamond wheel; groove grinding;
fLanguage
English
Publisher
ieee
Conference_Titel
Control and Automation (ICCA), 2010 8th IEEE International Conference on
Conference_Location
Xiamen
ISSN
1948-3449
Print_ISBN
978-1-4244-5195-1
Electronic_ISBN
1948-3449
Type
conf
DOI
10.1109/ICCA.2010.5524334
Filename
5524334
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