• DocumentCode
    3220047
  • Title

    Silicon carbide power devices for high temperature, high power density switching applications

  • Author

    Burke, T. ; Xie, K. ; Flemish, J.R. ; Singh, H. ; Podlesak, T. ; Zhao, J.H.

  • Author_Institution
    US Army Res. Lab., Fort Monmouth, NJ, USA
  • fYear
    1996
  • fDate
    25-27 Jun 1996
  • Firstpage
    18
  • Lastpage
    21
  • Abstract
    Silicon carbide (SiC) has been attracting much attention because of its potential application to high performance power devices with the capability of operating at high temperature. Here, the authors briefly describe SiC´s advantages for high pulsed power devices, review the state-of the-art in prototype SiC power device performance and present simulation results and thermal calculations which predict the capability of SiC thyristors in high-power pulse applications
  • Keywords
    pulsed power switches; silicon compounds; thermal analysis; SiC; SiC pulsed power switches; application; capability prediction; high temperature operation; power device performance; simulation results; state-of the-art; thermal calculations; Application software; Breakdown voltage; Current density; MOSFETs; Prototypes; Silicon carbide; Temperature; Thermal conductivity; Thermal resistance; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Modulator Symposium, 1996., Twenty-Second International
  • Conference_Location
    Boca Raton, FL
  • Print_ISBN
    0-7803-3076-5
  • Type

    conf

  • DOI
    10.1109/MODSYM.1996.564439
  • Filename
    564439