DocumentCode
3220047
Title
Silicon carbide power devices for high temperature, high power density switching applications
Author
Burke, T. ; Xie, K. ; Flemish, J.R. ; Singh, H. ; Podlesak, T. ; Zhao, J.H.
Author_Institution
US Army Res. Lab., Fort Monmouth, NJ, USA
fYear
1996
fDate
25-27 Jun 1996
Firstpage
18
Lastpage
21
Abstract
Silicon carbide (SiC) has been attracting much attention because of its potential application to high performance power devices with the capability of operating at high temperature. Here, the authors briefly describe SiC´s advantages for high pulsed power devices, review the state-of the-art in prototype SiC power device performance and present simulation results and thermal calculations which predict the capability of SiC thyristors in high-power pulse applications
Keywords
pulsed power switches; silicon compounds; thermal analysis; SiC; SiC pulsed power switches; application; capability prediction; high temperature operation; power device performance; simulation results; state-of the-art; thermal calculations; Application software; Breakdown voltage; Current density; MOSFETs; Prototypes; Silicon carbide; Temperature; Thermal conductivity; Thermal resistance; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Modulator Symposium, 1996., Twenty-Second International
Conference_Location
Boca Raton, FL
Print_ISBN
0-7803-3076-5
Type
conf
DOI
10.1109/MODSYM.1996.564439
Filename
564439
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