DocumentCode
3220163
Title
Material impact on FBGA package reliability
Author
Koh, W. ; Kong, F.
Author_Institution
Kingston Technol., Fountain Valley, CA, USA
fYear
2005
fDate
16-18 March 2005
Firstpage
126
Lastpage
129
Abstract
The materials used in a fine pitch ball grid array (FBGA) package for dynamic random access memory (DRAM) module assembly is investigated under environmental stress to accelerate failure. These failure modes and mechanisms are investigated and design changes and material selections altered to improve the overall package reliability. Failure analysis included using X-ray and ultrasonic scan, as well as cross sectioning and scanning electronic micrograph (SEM).
Keywords
DRAM chips; assembling; ball grid arrays; failure analysis; fine-pitch technology; integrated circuit packaging; integrated circuit reliability; DRAM module assembly; FBGA package reliability; X-ray scan; cross sectioning; design changes; dynamic random access memory; environmental stress; failure analysis; fine pitch ball grid array; material selections; scanning electronic micrograph; ultrasonic scan; Assembly; Bonding; Chip scale packaging; DRAM chips; Electronics packaging; Failure analysis; Materials reliability; Random access memory; Testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
ISSN
1550-5723
Print_ISBN
0-7803-9085-7
Electronic_ISBN
1550-5723
Type
conf
DOI
10.1109/ISAPM.2005.1432061
Filename
1432061
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