Title :
Material impact on FBGA package reliability
Author :
Koh, W. ; Kong, F.
Author_Institution :
Kingston Technol., Fountain Valley, CA, USA
Abstract :
The materials used in a fine pitch ball grid array (FBGA) package for dynamic random access memory (DRAM) module assembly is investigated under environmental stress to accelerate failure. These failure modes and mechanisms are investigated and design changes and material selections altered to improve the overall package reliability. Failure analysis included using X-ray and ultrasonic scan, as well as cross sectioning and scanning electronic micrograph (SEM).
Keywords :
DRAM chips; assembling; ball grid arrays; failure analysis; fine-pitch technology; integrated circuit packaging; integrated circuit reliability; DRAM module assembly; FBGA package reliability; X-ray scan; cross sectioning; design changes; dynamic random access memory; environmental stress; failure analysis; fine pitch ball grid array; material selections; scanning electronic micrograph; ultrasonic scan; Assembly; Bonding; Chip scale packaging; DRAM chips; Electronics packaging; Failure analysis; Materials reliability; Random access memory; Testing; Wire;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2005.1432061
