DocumentCode :
3220380
Title :
Recent progress and future developments in EB mask writing for X-ray lithography
Author :
Nakayama, Yoshinori
Author_Institution :
Super-fine SR Lithography Lab., Assoc. of Super-Adv. Electron. Technol., Atsugi, Japan
fYear :
1999
fDate :
6-8 July 1999
Firstpage :
8
Abstract :
Proximity X-ray lithography is one of the most promising candidate for mass production of the next generation ULSI devices. Among the key technologies of proximity X-ray lithography, fine and precise X-ray mask fabrication is most important issue. According to SIA Roadmap high-accurate image placement and CD control within 10 nm of X-ray mask are required for 0.1-/spl mu/m ULSI device fabrication. Therefore a great deal of developments should be achieved for X-ray mask fabrication which was contained mask materials and mask-fabrication processes including pattern delineation using electron-beam (EB) writer. Especially improvement in EB mask writing is indispensable for high-accurate image placement and CD control. In this paper, recent progress and future developments in EB mask writing for X-ray lithography are described.
Keywords :
X-ray masks; electron beam lithography; proximity effect (lithography); technological forecasting; CD control; ULSI device; X-ray mask fabrication; electron beam writing; image placement; proximity X-ray lithography; Fabrication; Laboratories; Mass production; Optical interferometry; Strontium; Thermal management; Ultra large scale integration; Writing; X-ray imaging; X-ray lithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 1999. Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International
Conference_Location :
Yokohama, Japan
Print_ISBN :
4-930813-97-2
Type :
conf
DOI :
10.1109/IMNC.1999.797450
Filename :
797450
Link To Document :
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