Intermetallic Compound Formation in Au/Al Thermosonic Wire Bonding During High Temperature Annealing at 150 Â°C as a Function of Wire Material

Author

Klengel, R. ; Knoll, H. ; Petzold, M. ; Wohnig, M. ; Schrapler, Lutz

Author_Institution

Fraunhofer Inst. for Mech. of Mater., Heideallee

Volume

1

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

370

Lastpage

375

Abstract

The paper is focused on the Au-Al intermetallic compound (IMC) formation and growth as well as the void formation in thermosonic wire bond ball contacts. Three different wire types were bonded on two different Al pad metallization with optimized bonding parameter, stressed by high temperature storage (NTS) conditions at 150degC up to 200 hours and investigated by light microscopy (LM), scanning electron microscopy (SEM) in addition to energy dispersive X-ray analysis (EDX). It was found that the investigated Pd-doped 2N wire exhibited both the lowest IMC growth as well as defect formation rate in comparison to the additionally investigated 4N and 4.5N wires

Keywords

X-ray chemical analysis; aluminium alloys; annealing; gold alloys; lead bonding; metallisation; optical microscopy; scanning electron microscopy; voids (solid); wires; 150 C; 200 h; Au-Al; EDX; SEM; ball contacts; energy dispersive X-ray analysis; high temperature annealing; intermetallic compound formation; light microscopy; scanning electron microscopy; thermosonic wire bonding; void formation; wire material; Annealing; Bonding; Dispersion; Energy storage; Gold; Intermetallic; Metallization; Scanning electron microscopy; Temperature; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280028

Filename

4060752