• DocumentCode
    3220525
  • Title

    Vorpal as a Tool for Three-Dimensional Simulations of Multipacting in Superconducting RF Cavities

  • Author

    Nieter, C. ; Stoltz, P.H. ; Cary, J.R. ; Werner, G.R.

  • Author_Institution
    Tech-X Corporation, Boulder, CO, nieter@txcorp.com
  • fYear
    2005
  • fDate
    16-20 May 2005
  • Firstpage
    4332
  • Lastpage
    4334
  • Abstract
    Considerable resources are required to run three dimensional simulations of multipacting in superconducting radio frequency cavities. Three dimensional simulations are needed to understand the possible roles of non-axisymmetric features such as the power couplers. Such simulations require the ability to run in parallel. We consider the versatile plasma simulation code VORPAL as a possible platform to study such effects. VORPAL has a general 3D domain decomposition and can run in any physical dimension. VORPAL uses the CMEE library to model the secondary emission of electrons from metal surfaces. We present a three dimensional simulation of a simple pillbox RF cavity to demonstrate the potential of VORPAL to be a major simulation tool for superconducting radio frequency (SRF) cavities.
  • Keywords
    Computational modeling; Couplers; Electron emission; Libraries; Linux; Multidimensional systems; Plasma simulation; Radio frequency; Supercomputers; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 2005. PAC 2005. Proceedings of the
  • Print_ISBN
    0-7803-8859-3
  • Type

    conf

  • DOI
    10.1109/PAC.2005.1591812
  • Filename
    1591812