DocumentCode
3220525
Title
Vorpal as a Tool for Three-Dimensional Simulations of Multipacting in Superconducting RF Cavities
Author
Nieter, C. ; Stoltz, P.H. ; Cary, J.R. ; Werner, G.R.
Author_Institution
Tech-X Corporation, Boulder, CO, nieter@txcorp.com
fYear
2005
fDate
16-20 May 2005
Firstpage
4332
Lastpage
4334
Abstract
Considerable resources are required to run three dimensional simulations of multipacting in superconducting radio frequency cavities. Three dimensional simulations are needed to understand the possible roles of non-axisymmetric features such as the power couplers. Such simulations require the ability to run in parallel. We consider the versatile plasma simulation code VORPAL as a possible platform to study such effects. VORPAL has a general 3D domain decomposition and can run in any physical dimension. VORPAL uses the CMEE library to model the secondary emission of electrons from metal surfaces. We present a three dimensional simulation of a simple pillbox RF cavity to demonstrate the potential of VORPAL to be a major simulation tool for superconducting radio frequency (SRF) cavities.
Keywords
Computational modeling; Couplers; Electron emission; Libraries; Linux; Multidimensional systems; Plasma simulation; Radio frequency; Supercomputers; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Particle Accelerator Conference, 2005. PAC 2005. Proceedings of the
Print_ISBN
0-7803-8859-3
Type
conf
DOI
10.1109/PAC.2005.1591812
Filename
1591812
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