DocumentCode :
3220633
Title :
Characterization of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive
Author :
Kristiansen, Helge ; Zhang, Z.L. ; Liu, J.
Author_Institution :
Conpart A.S., Kjeller, Norway
fYear :
2005
fDate :
16-18 March 2005
Firstpage :
209
Lastpage :
213
Abstract :
Metal coated small (micron sized) polymer particles are used in developing anisotropic conductive adhesives (ACA). The mechanical properties of polymer particles are of crucial importance both to assembly process and the reliability of ACA. Tn this paper we present a method to determine the mechanical properties of polymer sphere particles by using inverse indentation test - soft elastic sphere against rigid flat. Finite element analyses have been carried out to study the large deformation contact between the sphere particle and a rigid flat. The classical Hertz solution works only for small sphere deformation. A modification has been made to the Hertz contact force-displacement solution and an approximate equation is presented. A capacitance based experimental setup for particle indentation has been built. The proposed method has been applied to determine the elastic properties of typical polymer particles used for conductive adhesives. For the metal plated polymer particles tested, it has been found that a linear elastic model seems to hold for a large range of deformation.
Keywords :
adhesives; coatings; conducting polymers; deformation; elasticity; failure analysis; finite element analysis; flip-chip devices; microassembling; particle reinforced composites; ACA; Hertz contact force-displacement solution; Hertz solution; anisotropic conductive adhesive; approximate equation; assembly process; capacitance based experimental setup; deformation contact; elastic properties; finite element analysis; inverse indentation test; linear elastic model; mechanical properties; metal-coated polymer sphere; micron sized polymer particle; reliability; rigid flat; soft elastic sphere; Anisotropic magnetoresistance; Assembly; Capacitance; Conductive adhesives; Deformable models; Equations; Finite element methods; Mechanical factors; Polymer films; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
ISSN :
1550-5723
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
Type :
conf
DOI :
10.1109/ISAPM.2005.1432077
Filename :
1432077
Link To Document :
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